J. F. Sillon : rechercher sur Z-Library

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1

Varifocal liquid lenses with integrated actuator, high focusing power and low operating voltage fabricated on 200 mm wafers

Arnaud Pouydebasque, Claudine Bridoux, Fabrice Jacquet, Stéphane Moreau, Eric Sage, Damien Saint-Patrice, Christophe Bouvier, Christophe Kopp, Gilles Marchand, Sébastien Bolis, Nicolas Sillon, Emmanue

Journal:

Sensors and Actuators A: Physical

Année:

2011

Langue:

english

Fichier:

PDF, 1.22 MB

english, 2011

2

Comparison of Inverse and Direct Evaporation Methods for Estimating Soil Hydraulic Properties under Different Tillage Practices

Richard, G., Sillon, J.F., Marloie, O.

Journal:

Soil Science Society of America Journal

Année:

2001

Langue:

english

Fichier:

PDF, 244 KB

english, 2001

3

System-on-Wafer: 2-D and 3-D Technologies for Heterogeneous Systems

Souriau, J.-C., Sillon, N., Brun, J., Boutry, H., Hilt, T., Henry, D., Poupon, G.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2011

Langue:

english

Fichier:

PDF, 1.99 MB

english, 2011

4

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Detailed Characterisation of Ni Microinsert Technology For Flip Chip Die on Wafer Attachment

Mathewson, A., Brun, J., Ponthenier, G., Franiatte, R., Nowodzinski, A., Sillon, N., Poupon, G, Deputot, F., Dubois-Bonvalot, B.

Année:

2007

Langue:

english

Fichier:

PDF, 4.03 MB

english, 2007

5

Hall thruster plasma fluctuations identified as the E×B electron drift instability: Modeling and fitting on experimental data

Cavalier, J., Lemoine, N., Bonhomme, G., Tsikata, S., Honoré, C., Grésillon, D.

Journal:

Physics of Plasmas

Année:

2013

Langue:

english

Fichier:

PDF, 1.12 MB

english, 2013

6

Fractal analysis of the root architecture ofGliricidia sepiumfor the spatial prediction of root branching, size and mass: model development and evaluation in agroforestry

Harry Ozier-Lafontaine, François Lecompte, Jean François Sillon

Journal:

Année:

1999

Langue:

english

Fichier:

PDF, 358 KB

english, 1999

7

Modelling daily root interactions for water in a tropical shrub and grass alley cropping system

J. F. Sillon, H. Ozier-Lafontaine, N. Brisson

Journal:

Agroforestry Systems

Année:

2000

Langue:

english

Fichier:

PDF, 175 KB

english, 2000

8

[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - First integration of Cu TSV using die-to-wafer direct bonding and planarization

Leduc, Patrick, Assous, Myriam, Di Cioccio, Lea, Zussy, Marc, Signamarcheix, Thomas, Roman, Ant, Rousseau, Maxime, Verrun, Sophie, Bally, Laurent, Bouchu, David, Cadix, Lionel, Farcy, Alexis, Sillon,

Année:

2009

Langue:

english

Fichier:

PDF, 753 KB

english, 2009

9

[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Effects of stress in polysilicon VIA - first TSV technology

Pares, G., Bresson, N., Moreau, S., Lapras, V., Henry, D., Sillon, N.

Année:

2010

Langue:

english

Fichier:

PDF, 1.30 MB

english, 2010

10

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Characterization and modelling of Si-substrate noise induced by RF signal propagating in TSV of 3D-IC stack

Brocard, M., Le Maitre, P., Bermond, C., Bar, P., Anciant, R., Farcy, A., Lacrevaz, T., Leduc, P., Coudrain, P., Hotellier, N., Ben Jamaa, H., Cheramy, S., Sillon, N., Marin, J-C., Flechet, B.

Année:

2012

Langue:

english

Fichier:

PDF, 1.24 MB

english, 2012

11

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Through Silicon Vias Technology for CMOS Image Sensors Packaging: Presentation of Technology and Electrical Results

Henry, D., Charbonnier, J., Chausse, P., Jacquet, F., Aventurier, B., Brunet-Manquat, C., Lapras, V., Anciant, R., Sillon, N., Dunne, B., Hotellier, N., Michailos, J.

Année:

2008

Langue:

english

Fichier:

PDF, 10.13 MB

english, 2008

12

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Temporary bonding for Chips In Wafer processing

Souriau, Jean-Charles, Jouve, Amandine, Sillon, Nicolas

Année:

2009

Langue:

english

Fichier:

PDF, 710 KB

english, 2009

13

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Mid-process through silicon vias technology using tungsten metallization: Process optimazation and electrical results

Pares, G., Minoret, S., Lugand, J F., Huet, S., Lapras, V., Anciant, R., Henry, D., Sillon, N., Dunne, B.

Année:

2009

Langue:

english

Fichier:

PDF, 848 KB

english, 2009

14

Device convolution effects on the collective scattering signal of the E × B mode from Hall thruster experiments: 2D dispersion relation

Cavalier, J., Lemoine, N., Bonhomme, G., Tsikata, S., Honoré, C., Grésillon, D.

Journal:

Physics of Plasmas

Année:

2012

Langue:

english

Fichier:

PDF, 1.18 MB

english, 2012

15

Ten-Year Follow-Up of a Consecutive Series of Children With Multichannel Cochlear Implants

Uziel, Alain S., Sillon, Martine, Vieu, Adrienne, Artieres, Fran??oise, Piron, Jean-Pierre, Daures, Jean-Pierre, Mondain, Michel

Journal:

Otology & Neurotology

Année:

2007

Langue:

english

Fichier:

PDF, 496 KB

english, 2007

16

Online Module for Carrier Screening in Ashkenazi Jewish Individuals Compared with In-Person Genetics Education: A Randomized Controlled Trial

Fan, Chia Wei, Castonguay, Lysanne, Rummell, Sonja, Lévesque, Sébastien, Mitchell, John J., Sillon, Guillaume

Journal:

Journal of Genetic Counseling

Année:

2017

Langue:

english

Fichier:

PDF, 637 KB

english, 2017

17

Novel Recurrent COL5A1 Genetic Variant Is Associated With a Dysplasia-Associated Arterial Disease Exhibiting Dissections and Fibromuscular Dysplasia

Richer, Julie, Hill, Hannah L., Wang, Yu, Yang, Min-Lee, Hunker, Kristina L., Lane, Jamie, Blackburn, Susan, Coleman, Dawn M., Eliason, Jonathan, Sillon, Guillaume, DâAgostino, Maria-Daniela, Jetty,

Journal:

Arteriosclerosis Thrombosis and Vascular Biology

Année:

2020

Fichier:

PDF, 664 KB

2020

18

RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking

L. Cadix, C. Bermond, C. Fuchs, A. Farcy, P. Leduc, L. DiCioccio, M. Assous, M. Rousseau, F. Lorut, L.L. Chapelon, B. Flechet, N. Sillon, P. Ancey

Journal:

Microelectronic Engineering

Année:

2010

Langue:

english

Fichier:

PDF, 593 KB

english, 2010

19

Varifocal liquid lenses with integrated actuator, high focusing power and low operating voltage fabricated on 200 mm wafers

Arnaud Pouydebasque, Claudine Bridoux, Fabrice Jacquet, Stéphane Moreau, Damien Saint-Patrice, Christophe Bouvier, Christophe Kopp, Gilles Marchand, Sébastien Bolis, Nicolas Sillon, Emmanuelle Vigier-

Journal:

Procedia Engineering

Année:

2010

Langue:

english

Fichier:

PDF, 904 KB

english, 2010

20

Micromachined mass spectrometer

Nicolas Sillon, Robert Baptist

Journal:

Sensors and Actuators B: Chemical

Année:

2002

Langue:

english

Fichier:

PDF, 737 KB

english, 2002

21

Effect of compaction on the porosity of a silty soil: influence on unsaturated hydraulic properties

G. Richard, I. Cousin, J. F. Sillon, A. Bruand, J. Guérif

Journal:

European Journal of Soil Science

Année:

2001

Langue:

english

Fichier:

PDF, 465 KB

english, 2001

22

J01 A European collection of veterinary pathogens isolated from sick food producing animals prior to antimicrobial treatment

V. THOMAS, R. BYWATER, M. CHATON-SCHAFFNER, E. DEROOVER, A. DE JONG, U. KLEIN, H. MARION, M. SILLON, M. STEGEMANN, M. VALL, J. WALTERS

Journal:

Journal of Veterinary Pharmacology and Therapeutics

Année:

2006

Langue:

english

Fichier:

PDF, 426 KB

english, 2006

23

System on Wafer: A New Silicon Concept in SiP

Poupon, G., Sillon, N., Henry, D., Gillot, C., Mathewson, A., Di Cioccio, L., Charlet, B., Leduc, P., Vinet, M., Batude, P.

Journal:

Proceedings of the IEEE

Année:

2009

Langue:

english

Fichier:

PDF, 1.40 MB

english, 2009

24

Imaging Calpain Protease Activity by Multiphoton FRET in Living Mice

Daniel Stockholm, Marc Bartoli, Guillaume Sillon, Nathalie Bourg, Jean Davoust, Isabelle Richard

Journal:

Journal of Molecular Biology

Année:

2005

Langue:

english

Fichier:

PDF, 466 KB

english, 2005

25

Tillage and traffic effects on soil hydraulic properties and evaporation

J.F. Sillon, G. Richard, I. Cousin

Journal:

Année:

2003

Langue:

english

Fichier:

PDF, 416 KB

english, 2003

26

Cochlear implantation in prelingually deafened children with residual hearing

Michel Mondain, Martine Sillon, Adrienne Vieu, Ann Levi, Françoise Reuillard-Artieres, Olivier Deguine, Bernard Fraysse, Nadine Cochard, Eric Truy, Alain Uziel

Journal:

International Journal of Pediatric Otorhinolaryngology

Année:

2002

Langue:

english

Fichier:

PDF, 182 KB

english, 2002

27

Influence of communication mode on speech intelligibility and syntactic structure of sentences in profoundly hearing impaired French children implanted between 5 and 9 years of age

A Vieu, M Mondaina, K Blanchard, M Sillon, F Reuillard-Artieres, E Tobey, A Uziela, J.P Piron

Journal:

International Journal of Pediatric Otorhinolaryngology

Année:

1998

Langue:

english

Fichier:

PDF, 138 KB

english, 1998

28

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Low Electrical Resistance Silicon Through Vias: Technology and Characterization

Henry, D., Belhachemi, D., Souriau, J.-C., Brunet-Manquat, C., Puget, C., Ponthenier, G., Vallejo, J.L., Lecouvey, C., Sillon, N.

Année:

2006

Langue:

english

Fichier:

PDF, 1.99 MB

english, 2006

29

[IEEE Technology (ICICDT) - Kaohsiung, Taiwan (2011.05.2-2011.05.4)] 2011 IEEE International Conference on IC Design & Technology - Through Silicon Via technology using tungsten metallization

Pares, G., Bresson, N., Minoret, S., Lapras, V., Brianceau, P., Lugand, J. F., Anciant, R., Sillon, N.

Année:

2011

Langue:

english

Fichier:

PDF, 1.05 MB

english, 2011

30

Charging Efficiency of the Electrical Low Pressure Impactor's Corona Charger: Influence of the Fractal Morphology of Nanoparticle Aggregates and Uncertainty Analysis of Experimental Results

Ouf, François-Xavier, Sillon, Philippe

Journal:

Aerosol Science & Technology

Année:

2009

Langue:

english

Fichier:

PDF, 2.43 MB

english, 2009

31

[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits

Cadix, Lionel, Farcy, Alexis, Bermond, Cedric, Fuchs, Christine, Leduc, Patrick, Rousseau, Maxime, Assous, Myriam, Valentian, Alexandre, Roullard, Julie, Eid, Elie, Sillon, Nicolas, Flechet, Bernard,

Année:

2009

Langue:

english

Fichier:

PDF, 1.20 MB

english, 2009

32

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Via first approach optimisation for Through Silicon Via applications

Laviron, Cyrille, Dunne, Brendan, Lapras, Valerie, Galbiati, Paola, Henry, David, Toia, Fabrizio, Moreau, Stephane, Anciant, Romain, Brunet-Manquat, Cahty, Sillon, Nicolas

Année:

2009

Langue:

english

Fichier:

PDF, 1.10 MB

english, 2009

33

[IEEE 2010 IEEE International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2010.06.6-2010.06.9)] 2010 IEEE International Interconnect Technology Conference - Integration and frequency dependent electrical modeling of Through Silicon Vias (TSV) for high density 3DICs

Cadix, L., Rousseau, M., Fuchs, C., Leduc, P., Thuaire, A., Farhane, R. El, Chaabouni, H., Anciant, R., Huguenin, J.-L., Coudrain, P., Farcy, A., Bermond, C., Sillon, N., Flechet, B., Ancey, P.

Année:

2010

Langue:

english

Fichier:

PDF, 567 KB

english, 2010

34

[IEEE 1993 IEEE Instrumentation and Measurement Technology Conference - Irvine, CA, USA (18-20 May 1993)] 1993 IEEE Instrumentation and Measurement Technology Conference - A 30 MHz-18 GHz fully automated far-field antenna measurement system

Brandissou, J.P., Maes, P., Ongareau, E., Sillon, J.C., Wyrwinski, J.

Année:

1993

Langue:

english

Fichier:

PDF, 522 KB

english, 1993

35

[IEEE 2008 IEEE International Conference on Microelectronic Test Structure (ICMTS) - Edinburgh, UK (2008.03.24-2008.03.27)] 2008 IEEE International Conference on Microelectronic Test Structures - Test structures for the evaluation of 3D chip interconnection schemes

Mathewson, A., Brun, J., Franiatte, R., Nowodzinski, A., Ancient, R., Sillon, N., Depoutot, F., Dubois-Bonvalot, B.

Année:

2008

Fichier:

PDF, 938 KB

2008

36

Self-Organized Macrostructures in Anodically Formed Mesoporous Silica

Frey, S., Grésillon, B., Ozanam, F., Chazalviel, J.-N., Carstensen, J., Föll, H., Wehrspohn, R. B.

Journal:

Electrochemical and Solid-State Letters

Année:

2005

Langue:

english

Fichier:

PDF, 880 KB

english, 2005

37

[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - High Aspect Ratio Vias First for Advanced Packaging

Henry, D., Baillin, X., Lapras, V., Sillon, N., Dunne, B., Hernandez, C., Vigier-Blanc, E.

Année:

2007

Langue:

english

Fichier:

PDF, 608 KB

english, 2007

38

Instantaneous electron energy distribution function in ion waves

Grésillon, D.

Journal:

Physics of Fluids

Année:

1973

Langue:

english

Fichier:

PDF, 481 KB

english, 1973

39

[IEEE 2008 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2008.12.15-2008.12.17)] 2008 IEEE International Electron Devices Meeting - Enabling technologies for 3D integration: From packaging miniaturization to advanced stacked ICs

Sillon, N., Astier, A., Boutry, H., Di Cioccio, L., Henry, D., Leduc, P.

Année:

2008

Langue:

english

Fichier:

PDF, 1.02 MB

english, 2008

40

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Through silicon vias technology for CMOS image sensors packaging

Henry, D., Jacquet, F., Neyret, M., Baillin, X., Enot, T., Lapras, V., Brunet-Manquat, C., Charbonnier, J., Aventurier, B., Sillon, N.

Année:

2008

Langue:

english

Fichier:

PDF, 906 KB

english, 2008

41

[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - New trends in wafer level packaging

Sillon, N., Henry, D., Souriau, J.-C., Brun, J., Boutry, H., Cheramy, S.

Année:

2009

Langue:

english

Fichier:

PDF, 2.06 MB

english, 2009

42

[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Reliability Aspects of Microinsert Based Interconnection Technologies

Mathewson, A., Brun, J., Franiatte, R., Nowodzinski, A., Sillon, N., Depoutot, F., Dubois-Bonvalot, B.

Année:

2007

Langue:

english

Fichier:

PDF, 929 KB

english, 2007

43

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Facilitating Ultrathin Wafer Handling for TSV Processing

Jouve, A., Fowler, S., Privett, M., Puligadda, R., Henry, D., Astier, A., Brun, J., Zussy, M., Sillon, N., Burggraf, J., Pargfrieder, S.

Année:

2008

Langue:

english

Fichier:

PDF, 5.21 MB

english, 2008

44

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Low Cost Lithography Solution for Advanced Packaging and Application to Through Silicon Via Process

Jacquet, F., Henry, D., Charbonnier, J., Bouzaida, N., Sillon, N., Tsai, C., Balut, C., Raine, J. S.

Année:

2008

Langue:

english

Fichier:

PDF, 6.44 MB

english, 2008

45

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Reliability characterization and process optimization of Ni-based microinsert interconnections for flip chip die on wafer attachment

Boutry, H., Brun, J., Nowodzinski, A., Sillon, N., Depoutot, F., Dubois-Bonvalot, B., Schmidt, C., Simon, M., Altmann, F.

Année:

2009

Langue:

english

Fichier:

PDF, 2.91 MB

english, 2009

46

[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - Process and RF modelling of TSV last approach for 3D RF interposer

Fuchs, C., Charbonnier, J., Cheramy, S., Cadix, L., Henry, D., Chausse, P., Hajji, O., Farcy, A., Garnier, G., Brunet-Manquat, C., Diaz, J., Anciant, R., Vincent, P., Sillon, N., Ancey, P.

Année:

2011

Langue:

english

Fichier:

PDF, 436 KB

english, 2011

47

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Development and characterisation of high electrical performances TSV for 3D applications

Henry, D., Cheramy, S., Charbonnier, J., Chausse, P., Neyret, M., Garnier, G., Brunet-Manquat, C., Verrun, S., Sillon, N., Bonnot, L., Farcy, A., Cadix, L., Rousseau, M., Saugier, E.

Année:

2009

Langue:

english

Fichier:

PDF, 1.43 MB

english, 2009

48

[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - TSV as an alternative to wire bonding for a wireless industrial product: another step towards 3D integration

Druais, G., Ancey, P., Chapelon, LL., Charbonnier, J., Cheramy, S., Dodo, Y., Farcy, A., Garnier, G., Guillou, Y., Henry, D., Leduc, P., Pruvost, J., Saugier, E., Sillon, N.

Année:

2010

Langue:

english

Fichier:

PDF, 1.10 MB

english, 2010

49

[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Low cost Thin Film packaging for MEMS over molded

Pornin, Jean-Louis, Gillot, Charlotte, Billard, Christophe, Lagoutte, Emmanuelle, Pellat, Michel, Parat, Guy, Sillon, Nicolas

Année:

2010

Langue:

english

Fichier:

PDF, 894 KB

english, 2010

50

ECS Transactions [AAPM 25th Symposium on Microelectronics Technology and Devices - Sao Paulo, Brazil (September 6 - September 9, 2010)] - (Invited) Future Challenges and Diversifications for Nanoelectronics by the End of the Roadmap and Beyond

Deleonibus, S., Aid, M., De Salvo, B., Ernst, T., Faynot, O., Fedeli, J.-M., Giffard, B., Le Royer, C., Poiroux, T., Robert, P., Sillon, N., Vinet, M., Pavanello, M., Claeys, C., Martino, J.

Année:

2010

Langue:

english

Fichier:

PDF, 1.01 MB

english, 2010